Shenzhen Advanced Packaging Technology Co., Ltd. (abbreviation: Shenzhen Advanced) has a team of technical experts with more than 10 academicians, professors, post-doctoral/doctoral talents, and its technical fields cover semiconductor front-end process (wafer manufacturing), back-end process (advanced packaging), equipment &materials and reliability simulation testing, etc., can provide customers with one-stop technical support services from wafer manufacturing to SMT. The team members have worked in the core technology departments of companies such as Canon, Micron, StatschipPAC, Intel, HiSilicon, SMIC, and Qizhong Technology, and have won many awards. A technology patent, has a wealth of industrial and technical experience.
Deep Advanced also has high-quality industry customers, expert consultant resources, university teams, industry research cooperation institutions and other resources, combined with the company's own expert team, to provide customers with highly competitive technical solutions.