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  • Business vision

    To build an international leading integrated circuit packaging technology service platform

  • Business objectives

    I. Focus on supporting the development of integrated circuit packaging technology and project incubation in the business community
    II. Cultivate integrated circuit packaging technology talents through school enterprise joint projects

  • Core competitiveness

    I. Industry-leading integrated circuit manufacturing equipment, testing equipment, auxiliary tools and electronic material partners
    II. High-quality industry customers, expert consultant resources, university teams and industry research cooperation institutions
    III. Professional laboratory operation management team

B920, building 9, zone 2, Shenzhen Bay science and technology ecological park, No. 3609 Baishi Road, high tech community, Yuehai street, Nanshan District, Shenzhen

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